Heat transfer in electronic equipment, 1986
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Heat transfer in electronic equipment, 1986

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Published by American Society of Mechanical Engineers in New York, N.Y. (345 E. 47 St., New York 10017) .
Written in English


  • Electronic apparatus and appliances -- Cooling -- Congresses.,
  • Heat -- Transmission -- Congresses.

Book details:

Edition Notes

Includes bibliographies.

Statementpresented at the AIAA/ASME 4th Thermophysics and Heat Transfer Conference, Boston, Massachusetts, June 2-4, 1986 ; sponsored by the K-16 Committee on Heat Transfer in Electronic Equipment, the Heat Transfer Division, ASME ; edited by A. Bar-Cohen.
SeriesHTD ;, vol. 57, HTD (Series) ;, v. 57.
ContributionsBar-Cohen, Avram, 1946-, American Society of Mechanical Engineers. K-16 Committee on Heat Transfer in Electronic Equipment.
LC ClassificationsTK7870.25 .A38 1986
The Physical Object
Paginationx, 243 p. :
Number of Pages243
ID Numbers
Open LibraryOL2308677M
LC Control Number86185823

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Chapters contributed by thirty world-renown experts. * Covers all aspects of heat transfer, including micro-scale and heat transfer in electronic equipment. * An associated Web site offers computer formulations on thermophysical properties that provide the most up-to-date values. [Show full abstract] publications in the area of thermal management of electronic equipment. With this new chapter, the book is complete and whole in the area of thermal design of electronics : Lian-Tuu Yeh. This shorter text fully explains the fundamentals of heat transfer, including heat conduction, convection, radiation and heat exchangers. The fundamentals are then applied to a variety of engineering examples, including topics of special and current interest like solar collectors, cooling of electronic equipment, and energy conservation in. To begin reading the book online click a chapter below. Preface. Introduction. Generalized Governing Equations. Heat Conduction. External Convective Heat and Mass Transfer. Internal Convective Heat Transfer. Natural Convection. Condensation and Evaporation.

The section on forced convection cooling deals with the problem of heat transfer from an array of packages in a parallel-plate channel. The final section is devoted to the research topics of nucleate boiling heat transfer enhancement, from the surface of a small component, and microchannel cooling. •A variety of high-intensity heat transfer processes are involved with combustion and chemical reaction in the gasifier unit itself. •The gas goes through various cleanup and pipe-delivery processes to get to our heat transfer processes involved in these stages are generally less intense. To validate the porous medium model and the analytical solutions based on that model, the closed-form solution for the velocity distribution in the fully-developed channel flow and the numerical solutions for the conjugate heat transfer problem, comprising the solid fin and the fluid, are also obtained. Heat Transfer Handbook Details This handbook provides practitioners and other researchers with up-to-date information on heat transfer, with main results and correlations summarized at the end of each chapter for quick reference. Digitized Graphs have been added, as well as Interactive Thermophysical Properties tables.

1. Introduction. In a recent year, the vapor chamber and heat pipe are employed as heat transfer device to transfer heat for various electronic applications which results in high thermal conductive heat transfer devices and many times better than traditional cooling technique such as heat sink . Heat Transfer: Thermal Management of Electronics details how engineers can use intelligent thermal design to prevent heat-related failures, increase the life expectancy of the system, and reduce emitted noise, energy consumption, cost, and time to market. Appropriate thermal management can also create a significant market differentiation. First, heat must traverse the chip and heat spreader, where a portion of the allowable temperature drop occurs. Second, the heat sink conducts heat away from the active regions. Download: Download high-res image (KB) Download: Download full-size image; Fig. 1. Schematic of a Si microprocessor, heat spreader (typically made of Cu), and heat. Heat Exchangers Experimental Methods Heat Transfer in Electronic Equipment Heat Transfer Enhancement Porous Media Heat Pipes Heat Transfer in Manufacturing and Materials Processing Microscale Heat Transfer Direct Contact Heat Transfer .